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NTMS4872N
Power MOSFET
30 V, 10.2 A, N ? Channel, SO ? 8
Features
? Low R DS(on) to Minimize Conduction Losses
? Low Capacitance to Minimize Driver Losses
? Optimized Gate Charge to Minimize Switching Losses
? SOIC ? 8 Surface Mount Package Saves Board Space
? This is a Pb ? Free Device
Applications
? Disk Drives
? DC ? DC Converters
? Printers
MAXIMUM RATINGS (T J = 25 ° C unless otherwise stated)
V (BR)DSS
30 V
http://onsemi.com
R DS(ON) MAX
13.5 m W @ 10 V
16.5 m W @ 4.5 V
N ? Channel
D
I D MAX
10.2 A
Parameter
Drain ? to ? Source Voltage
Symbol
V DSS
Value
30
Unit
V
Gate ? to ? Source Voltage
Continuous Drain
Current R q JA (Note 1)
Power Dissipation R q JA
(Note 1)
Continuous Drain
Current R q JA (Note 2)
Power Dissipation R q JA
(Note 2)
Continuous Drain
Current R q JC , t v 10 s
(Note 1)
Steady
State
T A = 25 ° C
T A = 70 ° C
T A = 25 ° C
T A = 25 ° C
T A = 70 ° C
T A = 25 ° C
T C = 25 ° C
T C = 70 ° C
V GS
I D
P D
I D
P D
I D
± 20
8.0
6.4
1.49
6.0
4.8
0.82
10.2
8.2
V
A
W
A
W
A
1
SO ? 8
CASE 751
STYLE 12
G
S
MARKING DIAGRAM/
PIN ASSIGNMENT
1 8
Source Drain
Source Drain
Source Drain
Gate Drain
Top View
Power Dissipation
R q JC , t v 10 s(Note 1)
T C = 25 ° C
P D
2.4
W
4872N = Device Code
A = Assembly Location
Pulsed Drain Current T A = 25 ° C, t p = 10 m s
Operating Junction and Storage Temperature
Source Current (Body Diode)
Single Pulse Drain ? to ? Source Avalanche Energy
(T J = 25 ° C, V DD = 30 V, V GS = 10 V,
I L = 7.0 A pk , L = 1.0 mH, R G = 25 W )
I DM
T J ,
T stg
I S
E AS
56
? 55 to
150
2.4
24.5
A
° C
A
mJ
Y = Year
WW = Work Week
G = Pb ? Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
Device Package Shipping ?
Lead Temperature for Soldering Purposes
(1/8 ″ from case for 10 s)
T L
260
° C
NTMS4872NR2G
SO ? 8
(Pb ? Free)
2500/Tape & Reel
THERMAL RESISTANCE MAXIMUM RATINGS
Parameter Symbol
Junction ? to ? Ambient – Steady State (Note 1) R q JA
Junction ? to ? Ambient – t v 10 s (Note 1)
R q JA
Junction ? to ? Foot (Drain)
R q JF
Junction ? to ? Ambient – Steady State (Note 2)
R q JA
Value
84
52
22.5
153
Unit
° C/W
?For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Surfacemounted on FR4 board using 1 sq ? in pad, 2 oz Cu.
2. Surfacemounted on FR4 board using the minimum recommended pad size.
? Semiconductor Components Industries, LLC, 2009
January, 2009 ? Rev. 2
1
Publication Order Number:
NTMS4872N/D
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